The manufacturing of high thermal conductivity industrial control aluminum substrate needs to take into account both material properties and functional requirements. Through multiple precision processes, the raw materials are transformed into practical substrates with both heat dissipation and electrical performance.
At the beginning of manufacturing, the raw materials need to be strictly screened. The core materials of high thermal conductivity industrial control aluminum substrate include metal aluminum substrate, insulation layer material and copper foil. The aluminum substrate is required to have good thermal conductivity and mechanical strength, and usually a high-purity aluminum plate is selected; the insulation layer material needs to have excellent insulation and thermal conductivity, and common ones are epoxy resins, ceramic fillings, etc.; the copper foil needs to have a flat surface and uniform thickness to ensure the precise production of subsequent circuit graphics. After the material selection is completed, the surface of the aluminum plate should be cleaned to remove impurities such as oil, oxide film, etc. to ensure its fit with the insulation layer.
Then enter the insulation layer coating process. The prepared insulation material is coated on the surface of the aluminum plate through a specific process to form a uniform insulation layer. There are many coating methods, such as scraping, roller coating, spraying, etc., each method has its own advantages and disadvantages. Scraping is suitable for thicker coatings and can ensure a certain degree of flatness; roller coating is efficient and has better coating thickness uniformity; spraying can achieve thinner and more uniform coatings. After coating, the insulating layer needs to be cured, and the insulating material is cross-linked by heating to enhance its physical and chemical properties and form a stable insulating and thermally conductive layer.
Copper foil lamination is one of the key steps. The treated copper foil is precisely laminated on the cured insulating layer. This process requires extremely high pressure, temperature and time control. Insufficient pressure will cause the copper foil to not fit tightly with the insulating layer, affecting the electrical performance and heat dissipation effect; excessive pressure may damage the copper foil or the insulating layer. The appropriate temperature should be used during lamination to promote the adhesive to work and firmly bond the copper foil to the insulating layer. After lamination, hot pressing is required to further enhance the bonding force between the three and ensure the overall stability of the substrate.
Circuit pattern production gives high thermal conductivity industrial control aluminum substrate functionality. First, the designed circuit pattern is transferred to the copper foil surface through photolithography technology. Photoresist is coated on the surface of copper foil, and after exposure and development, the photoresist forms a pattern corresponding to the circuit pattern. During the exposure process, light shines through the mask onto the photoresist, causing a photochemical reaction; development removes the unexposed or overexposed photoresist, leaving a precise circuit pattern. Subsequently, the copper foil not protected by the photoresist is removed by etching to form the required circuit line.
After the circuit pattern is completed, the high thermal conductivity industrial control aluminum substrate needs to be surface treated. The purpose of surface treatment is to protect the copper foil circuit and enhance solderability and anti-oxidation ability. Common surface treatment methods include immersion gold, tin plating, OSP (organic solderability protectant), etc. The immersion gold process deposits a layer of gold on the surface of the copper foil, which can significantly improve welding reliability and electrical performance; tin plating can reduce production costs and has good solderability; the transparent organic film layer formed by OSP treatment can effectively prevent copper foil oxidation without affecting the welding effect.
In order to ensure that the high thermal conductivity industrial control aluminum substrate meets the use requirements, a series of testing processes are required. Appearance inspection mainly checks whether there are scratches, holes, copper foil peeling and other defects on the surface of the substrate; electrical performance inspection includes testing the conductivity of the circuit, insulation resistance and other indicators to ensure the normal function of the circuit; heat dissipation performance inspection simulates the actual use environment and evaluates the thermal conductivity efficiency of the substrate. Only products that pass various tests can enter the final packaging process.
The packaging process needs to consider the protection and transportation needs of the product. Put the qualified high thermal conductivity industrial control aluminum substrate into an anti-static packaging bag to prevent static electricity from damaging the substrate; fix it with a hard packaging box on the outside to avoid collision and extrusion during transportation. At this point, the high thermal conductivity industrial control aluminum substrate has completed the full process manufacturing from raw materials to finished products, and can be put into use in industrial control and other fields.
