In order to improve the power handling capacity of the high power and high thermal conductivity aluminum substrate, effective heat dissipation design is required.
In order to improve the power handling capacity of the high power and high thermal conductivity aluminum substrate, effective heat dissipation design is required.
In the electronics manufacturing industry, aluminum substrate, as an important electronic material, is widely used in various electronic devices due to its excellent thermal conductivity, mechanical strength and electrical properties.
In high-power LED lamps, the lighting ring aluminum substrate can more effectively reduce the operating temperature and extend the service life of the LED.
The electrical insulation performance of high thermal conductivity industrial control aluminum substrate is excellent.
In the field of industrial automation, efficient and stable operation of equipment is crucial.
Lighting ring aluminum substrate is very common in LED lighting applications. Its main function is to provide an efficient thermal conduction path to quickly conduct the heat generated by the LED to ensure the stability and life of the LED lamp.