According to the drilling drawings of the circuit design, use a high-precision CNC drilling machine to drill holes at designated locations. The diameter and depth of the holes must strictly meet the requirements.
With the rapid development of modern industrial control, power management, LED lighting and smart devices, the power density of electronic components is constantly increasing
The lighting ring aluminum substrate usually has a ring structure, and its shape characteristics must be fully considered during layout.
Chemical plating is a process of depositing a layer of metal or alloy coating on the surface of aluminum base fiberglass board through chemical reaction.
In the context of widespread application of modern electronic devices, the electromagnetic shielding design of the lighting ring aluminum substrate is crucial to reducing LED flicker interference.
High thermal conductivity industrial control aluminum substrate, as a substrate material with excellent heat dissipation performance, is gradually becoming the preferred solution for heat dissipation of high power density electronic equipment.