In the context of widespread application of modern electronic devices, the electromagnetic shielding design of the lighting ring aluminum substrate is crucial to reducing LED flicker interference.
High thermal conductivity industrial control aluminum substrate, as a substrate material with excellent heat dissipation performance, is gradually becoming the preferred solution for heat dissipation of high power density electronic equipment.
In order to improve the power handling capacity of the high power and high thermal conductivity aluminum substrate, effective heat dissipation design is required.
In the electronics manufacturing industry, aluminum substrate, as an important electronic material, is widely used in various electronic devices due to its excellent thermal conductivity, mechanical strength and electrical properties.
In high-power LED lamps, the lighting ring aluminum substrate can more effectively reduce the operating temperature and extend the service life of the LED.
The electrical insulation performance of high thermal conductivity industrial control aluminum substrate is excellent.